JPH0362665U - - Google Patents

Info

Publication number
JPH0362665U
JPH0362665U JP12007289U JP12007289U JPH0362665U JP H0362665 U JPH0362665 U JP H0362665U JP 12007289 U JP12007289 U JP 12007289U JP 12007289 U JP12007289 U JP 12007289U JP H0362665 U JPH0362665 U JP H0362665U
Authority
JP
Japan
Prior art keywords
circuit board
jet
rotated
soldering device
rotary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12007289U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0735650Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989120072U priority Critical patent/JPH0735650Y2/ja
Publication of JPH0362665U publication Critical patent/JPH0362665U/ja
Application granted granted Critical
Publication of JPH0735650Y2 publication Critical patent/JPH0735650Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP1989120072U 1989-10-13 1989-10-13 回転式浸漬半田付装置 Expired - Lifetime JPH0735650Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989120072U JPH0735650Y2 (ja) 1989-10-13 1989-10-13 回転式浸漬半田付装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989120072U JPH0735650Y2 (ja) 1989-10-13 1989-10-13 回転式浸漬半田付装置

Publications (2)

Publication Number Publication Date
JPH0362665U true JPH0362665U (en]) 1991-06-19
JPH0735650Y2 JPH0735650Y2 (ja) 1995-08-16

Family

ID=31668162

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989120072U Expired - Lifetime JPH0735650Y2 (ja) 1989-10-13 1989-10-13 回転式浸漬半田付装置

Country Status (1)

Country Link
JP (1) JPH0735650Y2 (en])

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6393468A (ja) * 1986-10-07 1988-04-23 Fuji Electric Co Ltd 半導体ウエハのデイツプはんだ付け法
JPS63242466A (ja) * 1987-03-30 1988-10-07 Tamura Seisakusho Co Ltd 噴流式はんだ付け装置
JPS6453764A (en) * 1987-08-24 1989-03-01 Tamura Seisakusho Kk Method and device for jet soldering

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6393468A (ja) * 1986-10-07 1988-04-23 Fuji Electric Co Ltd 半導体ウエハのデイツプはんだ付け法
JPS63242466A (ja) * 1987-03-30 1988-10-07 Tamura Seisakusho Co Ltd 噴流式はんだ付け装置
JPS6453764A (en) * 1987-08-24 1989-03-01 Tamura Seisakusho Kk Method and device for jet soldering

Also Published As

Publication number Publication date
JPH0735650Y2 (ja) 1995-08-16

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